CMK Corporation


Laser via build-up multi layer PWB using prepreg for every dielectric layer

Product & Technology Product & Technology


  • Even thin type PWB, keeps high rigidity by using prepreg for every build-up layer. (Suitable for multi layer HDI with thin core)
  • Excellent insulation reliability, dimensional stability and mounting stability.
  • Applicable for 0.4 mm pitch BGA/CSP mounting. (Land dia. : 200 um).
  • Applicable for impedance control.
  • Able to use halogen-free material and adopt Pb-free mounting.


  • Suit for automotive appliance such as ECU.
  • Any-Layer structure is available. Suitable for smart phone.