Laser via build-up multi layer PWB using prepreg for every dielectric layer
- Even thin type PWB, keeps high rigidity by using prepreg for every build-up layer. (Suitable for multi layer HDI with thin core)
- Excellent insulation reliability, dimensional stability and mounting stability.
- Applicable for 0.4 mm pitch BGA/CSP mounting. (Land dia. : 200 um).
- Applicable for impedance control.
- Able to use halogen-free material and adopt Pb-free mounting.
- Suit for automotive appliance such as ECU.
- Any-Layer structure is available. Suitable for smart phone.