Stress Easing PWB Technology series | PRODUCT

Concept

Control the spread of solder crack from thermal shock and improve the connectivity of mounted parts in severe circumstances.

Features

Reliability
Improved solder joint reliability. (Temperature cycle test)
Design
Covers conventional plated through hole PWB.
Environment
Includes Pb free soldering applications.

Application

Automotive: Direct engine mounting and actuator unit mounting.
Substitute for ceramic PWBs. (lighter weight/lower cost due to organic materials)

Structure

Conventional FR-4:Strain occurs between SMT and PCB because of difference of CTE (after Temperature cycle test) -> SEPT Series:The special structure developed by CMK can decline the strain between parts and materials. Suppress the solder crack.

Performance comparison

SEPT(Solder crack resistance:high, Cost:middle), Ceramics(Solder crack resistance:high, Cost:high), FR-4(Solder crack resistance:low, Cost:low), High Tg FR-4(Solder crack resistance:middle, Cost:middle)

What's SEPT

Cost performance:It succeed in balancing solder crack resistance and cost in high level
Substitute for ceramics:It realizes maximum solder crack resistance as an organic PWB

Contact

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