Rigid-Flex Series

Multi-layer PCB which unifies rigid boards and flexible substrates.

Meets the needs for more compactness by using foldable substrate.

It is a printed circuit board which connects 2 or more rigid boards by an integrated flexible substrate. The rigid portions offer convenient component placing and external connectors will no longer be needed.

Various line up

1st generation of Rigid-Flex PCB's

1st-Gen Rigid-Flex with wide range of variation possibilities.

Features

Connector-less and wireless structure reducing wiring board area, contact resistance, wiring length and therefore suitable for high-speed signal.
3D design is possible and contributes to the miniaturization of a product.
"One set and One board" makes it possible to cut overall cost containing components, assembly cost, inspection cost and so on.
Impedance control of flex part and simulation is also available.

Structure

Line up 1st generation RF

	Build-up layer	TH	BVH		BH	Layer structure
	Build-up layer	TH	outer layer	inner layer	BH	Layer structure
RF-1	-	○	-	-	-	4 - 8 L
RF-3-S	1	○	○	-	-	6, 8 L
RF-3-D	2	○	○	○	-	8 L
RF-3-SB	1	○	○	-	○	6, 8 L
RF-3-DB	2	○	○	○	○	8 L

○: Supported

Single build-up structure (Thickness:0.6〜1.0 mm), 6layer RF-3-SB. Double build-up structure (Thickness:〜0.95 mm), 8layer RF-3-DB/BVH stacked

2nd generation of Rigid-Flex PCB's

“2nd-Gen Rigid-Flex” for pursuing thinness with new material

Pursuing thinness with new material

High density and thin type by applying new material.

Features / Structure

All Layer corresponded to halogen-free.
Thin type:
4Layer 0.25mm (R&D Thinnest 0.18mm)
6Layer 0.39mm (R&D Thinnest 0.32mm)
By 4Layer, it can correspond to skip via structure.

4 layer RF 1-2-1 staggered: 0.18 - 0.25 mm, [R&D] 4 layer RF with skip-via: 0.23 mm, 6 layer RF 2-2-2 staggered: 0.32 - 0.39 mm