Technology
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2026.04.17EVENT
We join in the exhibition of 【SPEXA -Space Business Expo- 2026】 Please visit us at booth. (Please for further information refer to pdf file.)（0.5MB）
- 2026.04.01PRODUCT [Update of product information] PDF information has been updated.
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2025.12.15EVENT
We join in the exhibition of 【NEPCON JAPAN TOKYO 2026】 Please visit us at booth. (Please for further information refer to pdf file.)（0.8MB）
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2025.10.16EVENT
We join in the exhibition of 【Productronica 2025 in Munich, Germany】 Please visit us at booth. (Please for further information refer to pdf file.)（0.1MB）
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2025.10.03EVENT
We join in the exhibition of 【NAGOYA NEPCON JAPAN 2025】 Please visit us at booth. (Please for further information refer to pdf file.)（0.3MB）
Product
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For high heat dissipation or high current
Electric components heating can be protected by heat dissipation of base/core metal quickly.
Suitable for LED light, automotive ECU, PSU etc.
Folding PCB to smaller size is possible for 3D placement.
Suitable for smaller modules such as driving recording camera etc.
For high frequency and high speed transmission
It can be used for high frequency products by adapting low-Dk material.
Suitable for milli-wave radar products.
Higher density assembly is possible using any-layer structure with better electric insulation reliability and assembly performance for smartphone.
Approaching for automotive PCB
In order to attain privailing ADAS and autonomous driving, Approaching to higher density and higher performances requested PCB can be explained to you.
