R & D

1.The mission of the technology research and development head office

With “Originality, speed and accuracy”as our motto, we are committed to furthering research and development centered on electronic circuit boards, in order to anticipate the needs of our time

2. Technical trends surrounding the electronic circuit board

Today, there is remarkable technical innovation with smaller, lighter, faster, lower power consumption, etc. of electronics devices in areas such as the information communication field and the digital consumer electronics fields. We are conducting research and development of the electronic circuit boards that are important components used in such electronic devices, with high density, high heat radiation, high heat resistance, high reliability, high frequency compatibility, high-speed transmission compatibility, and compatibility with the environment as our main subjects

3. Research and development of component technologies

The research and development of the main subjects are promoted by being divided into the following main component technologies.

	Miniature circuit formation technology
	Plating technology to make high-definition circuit formation possible
	Evaluation of high-performance materials and development of processing technologies that are compatible with high-density and high-speed semiconductors
	Evaluation technology and simulation technology for high-frequency compatible boards
	Evaluation technology for next generation board materials
	Advancement and increased efficiency of developments that use computer simulation technology
	Compatibility with the environment

4. New product research and development

Based on component technology developments, we are primarily promoting new product development such as the following.

	Next generation build-up wiring boards (thin-model, high-density and high-frequency compatible, flex-rigid type, etc.)
	Highly multilayered boards
	Compound board with heterogeneous materials (high heat radiation boards, etc.)
	Built-in component boards
	Boards for semiconductor package use (rigid type, tape type)

5. Joint research and development with other companies

We are also actively involved in joint research and development with companies and organizations with leading technology, and we are moving forward to put distinctive new products on the market as quickly as possible.