Plating
or Conductive paste fills in the microvia holes in order to connect between
layers.
CMK provides the stacked via hole structure for all the CMK's Buildup PWBs.
CMK provides the stacked via hole structure for all the CMK's Buildup PWBs.
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Features |
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The via stack structure is possible for all of CMK's build up product line (4 types). |
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The solder eating during the CSP implementation, which is a problem with conventional conformal vias, will disappear, making even higher density mounting possible, not just the 0.5mm pitch. |
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Subland becomes unnecessary through via filling. |
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There are added heat radiating effects through via filling by copper plating. |
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Applications |
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narrow pitch CSP mounting is possible without the solder being eaten away. |
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Wiring is possible from above the ball pad, making it possible to realize high-density mounting. (Will also be compatible with 0.3 ? 0.4 mm pitch CSP in the future) |
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Click: Via Filling Technology Brochore. |  |
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Click: Contact us. | |
