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Features |
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However it is thin,strong
strength is realized by adpting prepreg in build-up layer. |
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Excellent insulation reliability,dimensional
stability and mounting stability. |
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BGA/CSP mounting of pad
pitch 0.5mm is possible(Land dia, : 275µm). |
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Applicable for impedance control. |
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Applicable for
the halogen-free material. |
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Applications |
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On-board apparatus such as engine control. |
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Applicable for notebookPC,desk-topPC,etc.as
large size build-up board. |
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Communication apparatus such as base
station for cellular phone. |
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Portable information terminal apparatus
such as cellular phone,PDA,etc. |
