While QFPs(Quad Flat Package) and TSOPs are presently the standard semiconductor packages, market requirements dictate that LSIs have more pins with smaller,thinner and lighter packages. As a result, the use of BGAs(Ball Rigid Arrays) and CSPs(Chip Size Packages) is rapidly spreading, especially for portable information terminals and notebook PCs.

Rigid type substrate is primarily used for BGAs and CSPs, as well as for traditional PWBs, and we intend to continuously work towards realizing more pins in a much smaller size package incorporating finer circuit patterns and thinner resin layers.