CLLAVIS
series is multilayer PWB with build-up layers on base. High-density patterning
and mounting are possible. This is build-up PWB in which conformal via holes
are formed on RCC (resin coated copper foil) by a laser method.
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CLLAVIS series includes the following products: |
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CLLAVIS-1 | Use of roll lamination method increases productivity. Suitable for large-sized products such as notebook PCs. |
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UT-CLLAVIS-1 | Thinner layer structure Total thinkness : Max 0.3mm(4 layer) Max 0.4mm(6 layer) Fine conductor width and manufacturing accuracy. High dense assmbly less than 0.5mm pitch CSP. |
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IV-CLLAVIS-1 | By the use of interstitial via hole (IVH) construction in the base and arranging the conformal via directly above this, different kinds of circuits such as the wireless and base band parts can be respectively mounted on the surface layer. |
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SUPER-CLLAVIS-1 | By plating the top of the plugged base via holes into the base, conformal via holes can be placed directly above it such that through-holes are not necessary and higher mounting density is realized. |
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CLLAVIS-2 | CLLAVIS-2 has two build-up layers and is suitable for L/S = 50/50µm. Via top land diameter is 250µm. Suitable for mounting multilane 0.5mm pitch CSP (Chip Size Package) and bare chip. |
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ex: 8 layer(2-4-2) | |
| *Via on Via structure. | ||
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Cross-sectional view | |
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<<R&D>>ex: 6 layer(2-2-2) | |
| *All layer Filld via structure. | ||
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Features |
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Easy pattern design from the surface that BGA and CSP are mounted. High-density patterning is possible. |
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Contributes to thinner, and lighter board. |
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Effective for high-speed signals due to low dielectric constant of build-up layers. |
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Through-holes are not necessary, allowing high-density mounting. |
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Suitable for use with halogen free materials for an environmentally conscious product. |
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Suitable for high-frequency applications(low line loss). |
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Suitable for applications reqiring impedance control. |
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Applications |
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Information terminal devices such as notebook PCs. |
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Small-sized video equipments such as digital video cameras. |
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On-board equipments such as car navigation systems. |
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Portable communication information terminal devices such as cellular phones and PDA. |
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Motherboards for mounting BGA and CSP. |
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Others. |
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Click: CLLAVIS SERIESE Brochore. |  |
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Click: Contact us. | |