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ALIVH® ALIVH®, with filled via structure in all layers is widely used for products such as cellular phones and portable audiovisual equipments requiring small-size, lightweight build-up PWB to achieve high-density mounting and free pattern design.
ALIVH®-C ALIVH®-C, in which ALIVH® is used as its base, is build-up PWB with conformal via holes in the external layers.High-density mounting is possible.
Features
Via hole can be provided in all layer so as increased area for free design available. Possible smaller unit in size.
Shorter pattern effective for high speed signal circuit.
Lighter weight by applying non-woven aramid reinforcement and plateless of copper in holes.
Required design time can be drastically reduced using free interlayer connections made possible by IVH construction in all layers.
Exellent in electorical property(ε=3.6/1GHz)possible. lighter unifying with high frequency signals.
Halogen free, Pb free and controlled impedance PWB are available.
Application
Portable communication information terminal devices such as cellular phones and PDA.
Small-sized electronic equipment such as digital video cameras.
Package substrate such as MCM.
Others.
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ALIVH®-C
*ALIVH® is a registered trade mark of
Matsushita Electric Industrial Co., Ltd.